Surface mount technology (SMT)

DTVS provides SMT assembly services for printed circuit boards (PCBs). Surface-mount assembly is carried out on four automated production lines, ensuring high precision, productivity, and manufacturing flexibility: 

  • Three lines are equipped with high-performance FUJI NXT II placement machines (a total of 42 modules).
  • One line is equipped with Yamaha YS12, Yamaha YS12F, and the high-speed Yamaha YSM20R component placement machines.
The total production capacity of the lines exceeds 1 million components per hour according to the IPC standard.

Surface mount technology (SMT)

Specifications

Minimum PCB size
50 mm x 50 mm
Maximum PCB size (L x W)
460 mm × 510 mm
Maximum PCB thickness
4 mm
Minimum component size (EIA)
01005
Maximum number of component types for simultaneous placement
460 (different component types)
Placement accuracy
30 μm

All SMT lines are equipped with modern KTR-1200-N convection reflow ovens designed for soldering in a nitrogen atmosphere. For processing large-size PCBs (including server boards up to 600 × 800 mm), an HC-850 automatic stencil printer is used. All production lines are equipped with laser marking systems that apply unique identification information to each PCB. Combined with the company’s in-house Traceability system, this ensures full lifecycle control of the products. 

Efficient post-soldering PCB cleaning is performed using a BC320 spray cleaning system.

A multi-level quality control system has been implemented at the facility, covering all stages of the production cycle:

  • Automated 3D solder paste inspection (SPI) — Parmi SigmaX Large and Omron VP9000 systems.
  • Dual automated 3D optical inspection (AOI) — Parmi Xceed Large and Omron VT-S530 / VT-S730 systems.
  • Comprehensive X-ray inspection — AXI-7300 inline system and PCBA-ANALYZER offline station.

lead-free

Lead-free assembly compliant with environmental standards.


GS Group is a Russian industrial investment company. Its key competence is development and production of electronics. Main activities also include development and manufacture of microelectronics, and the development and integration of software products.